Thermal nanoimprint equipement
EVG520HE, 200 mm full wafer system with the following specifications:
Maximum temperature:Tmax = 300°C
Integrated cooling down of the mold/wafer stack
Maximum applied force: 40 kN which leads to a maximum pressure / Pmax = 14 bars for on 200 mm wafer and mold imprinting.
Imprinted wafers: silicon, glass and polymers foils
